Next 7th March, 3NEO Platform in collaboration with the Spanish Technology Platform Packaging, PACKNET, organized the II Workshop 3NEO: New Opportunities in functional printing and printed electronics. This activity is included within the Working Group "Smart Packaging". For both entities would be a pleasure to have your presence.
The planned program is the following:
09:30h Reception and welcome
10:00h Opening act
10:15h Horizon 2020. Future lines in functional printing and printed electronics.
D. Stèphane Cros. FLEXNET
11:00h Networking Session in Smart Packaging. * The scope of this session will focus on highlighting areas that can provide of added value to the packaging by assigning new functions to strengthen brand image, security and anti-counterfeiting and traceability of the supply chain.
- Identification of needs
- Detection of market entry barriers
- Detecting opportunities
14:00h Working Lunch
* 1. Networking session and group dynamics will be led by expert.
* 2. All the information generated during the session will be unified and processed in a report that will be sent to the attendees in the days following the conclusion of the Workshop
Venue: Chamber of Commerce of Madrid http://www.camaramadrid.es/
Date: 7th March 2012 from 9.30 a.m to 16:00p.m
If you're interested in attending the workshop, please send an e-mail to secretaria@3neo.org
Funded by:
